印制電路相關(guān)英語詞匯

【來源：易教網(wǎng) 更新時間：2026-03-11】

一 綜合詞匯

印制電路：printed circuit

印制線路：printed wiring

印制板：printed board

印制板電路：printed circuit board (pcb)

印制線路板：printed wiring board(pwb)

印制元件：printed component

印制接點：printed contact

印制板裝配：printed board assembly

板：board

單面印制板：single-sided printed board(ssb)

雙面印制板：double-sided printed board(dsb)

多層印制板：mulitlayer printed board(mlb)

多層印制電路板：mulitlayer printed circuit board

多層印制線路板：mulitlayer prited wiring board

剛性印制板：rigid printed board

剛性單面印制板：rigid single-sided printed borad

剛性雙面印制板：rigid double-sided printed borad

剛性多層印制板：rigid multilayer printed board

撓性多層印制板：flexible multilayer printed board

撓性印制板：flexible printed board

撓性單面印制板：flexible single-sided printed board

撓性雙面印制板：flexible double-sided printed board

撓性印制電路：flexible printed circuit (fpc)

撓性印制線路：flexible printed wiring

剛性印制板：flex-rigid printed board, rigid-flex printed board

剛性雙面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed

剛性多層印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board

齊平印制板：flush printed board

金屬芯印制板：metal core printed board

金屬基印制板：metal base printed board

多重布線印制板：mulit-wiring printed board

陶瓷印制板：ceramic substrate printed board

導(dǎo)電膠印制板：electroconductive paste printed board

模塑電路板：molded circuit board

模壓印制板：stamped printed wiring board

順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer

散線印制板：discrete wiring board

微線印制板：micro wire board

積層印制板：buile-up printed board

積層多層印制板：build-up mulitlayer printed board (bum)

積層撓印制板：build-up flexible printed board

表面層合電路板：surface laminar circuit (slc)

埋入凸塊連印制板：b2it printed board

多層膜基板：multi-layered film substrate(mfs)

層間全內(nèi)導(dǎo)通多層印制板：alivh multilayer printed board

載芯片板：chip on board (cob)

埋電阻板：buried resistance board

母板：mother board

子板：daughter board

背板：backplane

裸板：bare board

鍵盤板夾心板：copper-invar-copper board

動態(tài)撓性板：dynamic flex board

靜態(tài)撓性板：static flex board

可斷拼板：break-away planel

電纜：cable

撓性扁平電纜：flexible flat cable (ffc)

薄膜開關(guān)：membrane switch

混合電路：hybrid circuit

厚膜：thick film

厚膜電路：thick film circuit

薄膜：thin film

薄膜混合電路：thin film hybrid circuit

互連：interconnection

導(dǎo)線：conductor trace line

齊平導(dǎo)線：flush conductor

傳輸線：transmission line

跨交：crossover

板邊插頭：edge-board contact

增強(qiáng)板：stiffener

基底：substrate

基板面：real estate

導(dǎo)線面：conductor side

元件面：component side

焊接面：solder side

印制：printing

網(wǎng)格：grid

圖形：pattern

導(dǎo)電圖形：conductive pattern

非導(dǎo)電圖形：non-conductive pattern

字符：legend

標(biāo)志：mark

二 基材：

基材：base material

層壓板：laminate

覆金屬箔基材：metal-clad bade material

覆銅箔層壓板：copper-clad laminate (ccl)

單面覆銅箔層壓板：single-sided copper-clad laminate

雙面覆銅箔層壓板：double-sided copper-clad laminate

復(fù)合層壓板：composite laminate

薄層壓板：thin laminate

金屬芯覆銅箔層壓板：metal core copper-clad laminate

金屬基覆銅層壓板：metal base copper-clad laminate

撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film

基體材料：basis material

預(yù)浸材料：prepreg

粘結(jié)片：bonding sheet

預(yù)浸粘結(jié)片：preimpregnated bonding sheer

環(huán)氧玻璃基板：epoxy glass substrate

加成法用層壓板：laminate for additive process

預(yù)制內(nèi)層覆箔板：mass lamination panel

內(nèi)層芯板：core material

催化板材：catalyzed board ,coated catalyzed laminate

涂膠催化層壓板：adhesive-coated catalyzed laminate

涂膠無催層壓板：adhesive-coated uncatalyzed laminate

粘結(jié)層：bonding layer

粘結(jié)膜：film adhesive

涂膠粘劑絕緣薄膜：adhesive coated dielectric film

無支撐膠粘劑膜：unsupported adhesive film

覆蓋層：cover layer (cover lay)

增強(qiáng)板材：stiffener material

銅箔面：copper-clad surface

去銅箔面：foil removal surface

層壓板面：unclad laminate surface

基膜面：base film surface

膠粘劑面：adhesive faec

原始光潔面：plate finish

粗面：matt finish

縱向：length wise direction

模向：cross wise direction

剪切板：cut to size panel

酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)

環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)

環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates

環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates

環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates

聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates

聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates

雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates

聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates

超薄型層壓板：ultra thin laminate

陶瓷基覆銅箔板：ceramics base copper-clad laminates

紫外線阻擋型覆銅箔板：uv blocking copper-clad laminates

三 基材的材料

a階樹脂：a-stage resin

b階樹脂：b-stage resin

c階樹脂：c-stage resin

環(huán)氧樹脂：epoxy resin

酚醛樹脂：phenolic resin

聚酯樹脂：polyester resin

聚酰亞胺樹脂：polyimide resin

雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin

丙烯酸樹脂：acrylic resin

三聚氰胺甲醛樹脂：melamine formaldehyde resin

多官能環(huán)氧樹脂：polyfunctional epoxy resin

溴化環(huán)氧樹脂：brominated epoxy resin

環(huán)氧酚醛：epoxy novolac

氟樹脂：fluroresin

硅樹脂：silicone resin

硅烷：silane

聚合物：polymer

無定形聚合物：amorphous polymer

結(jié)晶現(xiàn)象：crystalline polamer

雙晶現(xiàn)象：dimorphism

共聚物：copolymer

合成樹脂：synthetic

熱固性樹脂：thermosetting resin

熱塑性樹脂：thermoplastic resin

感光性樹脂：photosensitive resin

環(huán)氧當(dāng)量：weight per epoxy equivalent (wpe)

環(huán)氧值：epoxy value

雙氰胺：dicyandiamide

粘結(jié)劑：binder

膠粘劑：adesive

固化劑：curing agent

阻燃劑：flame retardant

遮光劑：opaquer

增塑劑：plasticizers

不飽和聚酯：unsatuiated polyester

聚酯薄膜：polyester

聚酰亞胺薄膜：polyimide film (pi)

聚四氟乙烯：polytetrafluoetylene (ptfe)

聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)

增強(qiáng)材料：reinforcing material

玻璃纖維：glass fiber

e玻璃纖維：e-glass fibre

d玻璃纖維：d-glass fibre

s玻璃纖維：s-glass fibre

玻璃布：glass fabric

非織布：non-woven fabric

玻璃纖維墊：glass mats

紗線：yarn

單絲：filament

絞股：strand

緯紗：weft yarn

經(jīng)紗：warp yarn

但尼爾：denier

經(jīng)向：warp-wise

緯向：weft-wise, filling-wise

織物經(jīng)緯密度：thread count

織物組織：weave structure

平紋組織：plain structure

壞布：grey fabric

稀松織物：woven scrim

弓緯：bow of weave

斷經(jīng)：end missing

缺緯：mis-picks

緯斜：bias

折痕：crease

云織：waviness

魚眼：fish eye

毛圈長：feather length

厚薄段：mark

裂縫：split

捻度：twist of yarn

浸潤劑含量：size content

浸潤劑殘留量：size residue

處理劑含量：finish level

浸潤劑：size

偶聯(lián)劑：couplint agent

處理織物：finished fabric

聚酰胺纖維：polyarmide fiber

聚酯纖維非織布：non-woven polyester fabric

浸漬絕緣縱紙：impregnating insulation paper

聚芳酰胺纖維紙：aromatic polyamide paper

斷裂長：breaking length

吸水高度：height of capillary rise

濕強(qiáng)度保留率：wet strength retention

白度：whitenness

陶瓷：ceramics

導(dǎo)電箔：conductive foil

銅箔：copper foil

電解銅箔：electrodeposited copper foil (ed copper foil)

壓延銅箔：rolled copper foil

退火銅箔：annealed copper foil

壓延退火銅箔：rolled annealed copper foil (ra copper foil)

薄銅箔：thin copper foil

涂膠銅箔：adhesive coated foil

涂膠脂銅箔：resin coated copper foil (rcc)

復(fù)合金屬箔：composite metallic material

載體箔：carrier foil

殷瓦：invar

箔（剖面）輪廓：foil profile

光面：shiny side

粗糙面：matte side

處理面：treated side

防銹處理：stain proofing

雙面處理銅箔：double treated foil

四 設(shè)計

原理圖：shematic diagram

邏輯圖：logic diagram

印制線路布設(shè)：printed wire layout

布設(shè)總圖：master drawing

可制造性設(shè)計：design-for-manufacturability

計算機(jī)輔助設(shè)計：computer-aided design.(cad)

計算機(jī)輔助制造：computer-aided manufacturing.(cam)

計算機(jī)集成制造：computer integrat manufacturing.(cim)

計算機(jī)輔助工程：computer-aided engineering.(cae)

計算機(jī)輔助測試：computer-aided test.(cat)

電子設(shè)計自動化：electric design automation .(eda)

工程設(shè)計自動化：engineering design automaton .(eda2)

組裝設(shè)計自動化：assembly aided architectural design. (aaad)

計算機(jī)輔助制圖：computer aided drawing

計算機(jī)控制顯示：computer controlled display .(ccd)

布局：placement

布線：routing

布圖設(shè)計：layout

重布：rerouting

模擬：simulation

邏輯模擬：logic simulation

電路模擬：circit simulation

時序模擬：timing simulation

模塊化：modularization

布線完成率：layout effeciency

機(jī)器描述格式：machine descriptionm format .(mdf)

機(jī)器描述格式數(shù)據(jù)庫：mdf databse

設(shè)計數(shù)據(jù)庫：design database

設(shè)計原點：design origin

優(yōu)化（設(shè)計）：optimization (design)

供設(shè)計優(yōu)化坐標(biāo)軸：predominant axis

表格原點：table origin

鏡像：mirroring

驅(qū)動文件：drive file

中間文件：intermediate file

制造文件：manufacturing documentation

隊列支撐數(shù)據(jù)庫：queue support database

元件安置：component positioning

圖形顯示：graphics display

比例因子：scaling factor

掃描填充：scan filling

矩形填充：rectangle filling

填充域：region filling

實體設(shè)計：physical design

邏輯設(shè)計：logic design

邏輯電路：logic circuit

層次設(shè)計：hierarchical design

自頂向下設(shè)計：top-down design

自底向上設(shè)計：bottom-up design

線網(wǎng)：net

數(shù)字化：digitzing

設(shè)計規(guī)則檢查：design rule checking

走（布）線器：router (cad)

網(wǎng)絡(luò)表：net list

計算機(jī)輔助電路分析：computer-aided circuit analysis

子線網(wǎng)：subnet

目標(biāo)函數(shù)：objective function

設(shè)計后處理：post design processing (pdp)

交互式制圖設(shè)計：interactive drawing design

費用矩陣：cost metrix

工程圖：engineering drawing

方塊框圖：block diagram

迷宮：moze

元件密度：component density

巡回售貨員問題：traveling salesman problem

自由度：degrees freedom

入度：out going degree

出度：incoming degree

曼哈頓距離：manhatton distance

歐幾里德距離：euclidean distance

網(wǎng)絡(luò)：network

陣列：array

段：segment

邏輯：logic

邏輯設(shè)計自動化：logic design automation

分線：separated time

分層：separated layer

定順序：definite sequence

五 形狀與尺寸：

導(dǎo)線（通道）：conduction (track)

導(dǎo)線（體）寬度：conductor width

導(dǎo)線距離：conductor spacing

導(dǎo)線層：conductor layer

導(dǎo)線寬度/間距：conductor line/space

第一導(dǎo)線層：conductor layer no.1

圓形盤：round pad

方形盤：square pad

菱形盤：diamond pad

長方形焊盤：oblong pad

子彈形盤：bullet pad

淚滴盤：teardrop pad

雪人盤：snowman pad

v形盤：v-shaped pad

環(huán)形盤：annular pad

非圓形盤：non-circular pad

隔離盤：isolation pad

非功能連接盤：monfunctional pad

偏置連接盤：offset land

腹（背）裸盤：back-bard land

盤址：anchoring spaur

連接盤圖形：land pattern

連接盤網(wǎng)格陣列：land grid array

孔環(huán)：annular ring

元件孔：component hole

安裝孔：mounting hole

支撐孔：supported hole

非支撐孔：unsupported hole

導(dǎo)通孔：via

鍍通孔：plated through hole (pth)

余隙孔：access hole

盲孔：blind via (hole)

埋孔：buried via hole

埋/盲孔：buried /blind via

任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (alivh)

全部鉆孔：all drilled hole

定位孔：toaling hole

無連接盤孔：landless hole

中間孔：interstitial hole

無連接盤導(dǎo)通孔：landless via hole

引導(dǎo)孔：pilot hole

端接全隙孔：terminal clearomee hole

準(zhǔn)表面間鍍覆孔：quasi-interfacing plated-through hole

準(zhǔn)尺寸孔：dimensioned hole

在連接盤中導(dǎo)通孔：via-in-pad

孔位：hole location

孔密度：hole density

孔圖：hole pattern

鉆孔圖：drill drawing

裝配圖：assembly drawing

印制板組裝圖：printed board assembly drawing

參考基準(zhǔn)：datum referan